PUR Hot Melt Adhesive 5704

Application: PUR Hot Melt Adhesive 5704, excellent polyurethane moisture reactive hot melt adhesive, perfectly for electronics structure fixing, waterproof sealing, such as phone, tablet computer. Operated with special PUR hot melt adhesive nozzles and applicators.

Processing temperature [°C]:120
Appearance:Cream color
Open time at 120 °C**:long (GC test method)
Viscosity at 120 °C [mPas]:2,800-3,600
PUR Hot Melt Adhesive 5704

PUR for electronics

Characteristics: Great resistance to moisture and chemistry. Good softness, flexibility and durability. Great initial bonding and peeling strength after moisture reaction. Fast setting. High performance. Stable adhesive properties. Longer and stronger lasting bonds. Great tolerance to wide range of temperature. Excellent bonding to difficult-bond substrates. Less consumption of adhesive for stronger bond. Operation friendly and fast curing.

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